Time & Location
Mar 31, 2021, 11:00 a.m. – 12:00 p.m. EDT
Dr. Jaber Derakhshandeh
About the event
Speaker: Dr. Jaber Derakhshanded, IMEC
Abstract: 3D stacking provides shorter interconnects to enable reduction in power consumption and higher operating frequency of electronic systems. In this talk, an overview of different building blocks of 3D technology including, wafer to wafer and die to wafer bonding, TSV and microbump’s pitch scaling and roadmap of 3D technology will be discussed.
Bio: Dr. Jaber Derakhshandeh received the bachelor’s, master and Ph.D. degrees all in electrical engineering. He was with TU Delft electrical engineering department, working on 3DIC, TFTs, CNTs, CMOS image sensors, electron, and X-ray detectors and teaching some courses. In 2013, he joined 3D system integration group at imec, where he is involved in exploratory projects in die-to-wafer stacking for high-density interconnections, solder based and Cu-Cu bonding, TCB, alternative materials and passivation options and quantum computers. He has supervised several master and PhD students in TU Delft and KU Leuven/IMEC. Furthermore, he is reviewer of several journal and conferences and has more than 200 published papers and patents.