Tue., Apr. 13 | Prof. Muhannad S. Bakir

Emerging 2.5D and 3D Heterogeneous Integration Architectures for the Next Phase of Moore’s Law

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Time & Location

Apr. 13, 3:00 p.m. – 4:00 p.m. EDT
Prof. Muhannad S. Bakir

About the Event

Speaker: Prof. Muhannad S. Bakir

Emerging 2.5D and 3D Heterogeneous Integration Architectures for the Next Phase of Moore’s Law

Abstract: Monolithic ICs have progressed at an unprecedented rate of innovation in the past ~60 years. But, with Moore’s Law slowing down, ‘polylithic' integration of heterogeneous ICs and devices is projected to be a key driver for performance, power, and cost in the next phase of Moore’s Law.

This presentation will first discuss various emerging heterogeneous integration approaches using 2.5D and 3D IC technologies, including those being developed at Georgia Tech’s Integrated 3D Systems Lab. Design considerations and benchmarking of power delivery, signaling, and thermal are also described. Second, a passive self-alignment and assembly approach for optical fibers is demonstrated using a combination of silicon micromachining and 3D printing to achieve sub-micron alignment accuracy to underlying silicon-on-insulator (SOI) substrate with monolithic waveguides and couplers in 2.5D/3D IC platforms.

Third, there exists a performance gap between TSV-based 3D and monolithic 3D ICs in terms of energy, bandwidth, and interconnect density. To bridge this gap, a 3D polylithic integration scheme is proposed which represents a densely integrated system divided into multiple heterogeneously integrated device tiers. This scheme, termed 3D seamless off-chip connectivity (3D SoC+), aims to combine the best of monolithic and TSV-based 3D ICs, including extreme efficient signaling and massive interconnect density without the fabrication limits of monolithic 3D ICs. As an enabling technology for 3D SoC+, we demonstrate the feasibility of using selective thermal cobalt ALD for Cu-Cu interconnect bonding at low temperature (200 oC).

Lastly, we experimentally demonstrate embedded microfluidic cooling technologies for 2.5D/3D IC architectures with electrical via integration to enable dense 2.5D/3D electronics with no thermal limits.

Bio: Muhannad S. Bakir is the Dan Fielder Professor in the School of Electrical and Computer Engineering at Georgia Tech.  His areas of interest include 2.5D and 3D heterogeneous integration, photonic interconnect networks and packaging, embedded cooling and power delivery for emerging integration architectures, and biosensors and their integration with CMOS circuitry. Dr. Bakir and his research group have received more than thirty paper and presentation awards including six from the IEEE Electronic Components and Technology Conference (ECTC), four from the IEEE International Interconnect Technology Conference (IITC), and one (best invited paper) from the IEEE Custom Integrated Circuits Conference (CICC). Dr. Bakir’s group was awarded Best Paper Awards from the 2014 and 2017 IEEE Transactions on Components Packaging and Manufacturing Technology (TCPMT). Dr. Bakir is the recipient of the 2013 Intel Early Career Faculty Honor Award, 2012 DARPA Young Faculty Award, 2011 IEEE CPMT Society Outstanding Young Engineer Award, and was an Invited Participant in the 2012 National Academy of Engineering Frontiers of Engineering Symposium. Dr. Bakir is the recipient of the 2018 IEEE Electronics Packaging Society (EPS) Exceptional Technical Achievement Award "for contributions to 2.5D and 3D IC heterogeneous integration, with focus on interconnect technologies." He is also the co-recipient of the 2018 McKnight Foundation Technological Innovations in Neuroscience Awards.

In 2020, Dr. Bakir was the recipient of the Georgia Tech Outstanding Doctoral Thesis Advisor Award. He is also the recipient of several teaching awards, including the 2014 and 2015 Georgia Institute of Technology Class of 1940 Course Survey Teaching Effectiveness Award, and the 2020 Student Recognition of Excellence in Teaching: Class of 1934 Award.

Dr. Bakir serves as a senior area editor of IEEE Transactions on Components, Packaging and Manufacturing Technology (TCPMT) and was an Editor of IEEE Transactions on Electron Devices (TED) from 2014-2020.

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