Trends and Challenges for Electrical Design and Analysis Using Advanced Packaging
Time & Location
About the Event
Speaker: Dr. Kemal Aygun, Senior Principal Engineer, Intel Inc.
Abstract: As the electronics industry is going through some rapid changes, the new electronics systems need to provide increasingly higher performance. As a result, the capability of the components that constitute these systems needs to also scale accordingly. One area where pace of innovation has greatly increased in recent years is semiconductor packaging. Paving the way for heterogeneous integration, these new ‘advanced’ packaging technologies aim to integrate multiple logic, memory, and other specialized silicon dies, potentially using different silicon process technologies, and provide unprecedented levels of performance in metrics such as IO bandwidth, bandwidth density, and power efficiency. This presentation will review some of these new advanced packaging technologies such as fan-out wafer/panel level and 2.xD packaging and the key challenges and some solutions for their electrical design and analysis.
Bio: Kemal Aygün received a Ph.D. in Electrical and Computer Engineering from the University of Illinois at Urbana–Champaign in 2002. In 2003, he joined Intel Corporation, Chandler, AZ, USA, where he is currently a Senior Principal Engineer and manages the High Speed I/O (HSIO) team in the Electrical Core Competency group. He has co-authored five book chapters, more than 80 journal and conference publications, and holds 61 U.S. patents. Dr. Aygün is a Distinguished Lecturer for the IEEE Electronics Packaging Society and was the general chair of the 2020 IEEE Electrical Performance of Electronic Packaging and Systems conference. He was also a recipient of the Semiconductor Research Corporation (SRC) Global Research Collaboration (GRC) Mahboob Khan Outstanding Mentor Award in 2008 and 2015 for his contributions in mentoring SRC GRC academic research projects.